As the technology node advances into the nanometer era, via-open defects are one of the dominant failures. To improve via yield and reliability, redundant-via insertion is a highl...
A new approach for inserting repeaters in 3-D interconnects is proposed. The allocation of repeaters along an interplane interconnect is iteratively determined. The proposed approa...
The planarization method has proven to be successful in graph drawing. The output, a combinatorial planar embedding of the so-called planarized graph, can be combined with state-o...
This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, ...
Many communication-centred systems today rely on asynchronous messaging among distributed peers to make efficient use of parallel execution and resource access. With such asynchron...