— We present a method for fast analysis of signal and power integrity based on a recently developed multilayered finite difference method (M-FDM). In order to accurately model m...
Power integrity simulation for system-on-package (SoP) based modules is a crucial bottleneck in the SoP design flow. In this paper, the multi-layer finite difference method (M-FDM...
Krishna Bharath, Ege Engin, Madhavan Swaminathan, ...
In the design of complex power distribution networks (PDN) with multiple power islands, it is required that the PDN represents a low impedance as seen by the digital modules. This...
Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-lev...
This paper presents an approach to the analysis of transient thermal states in electronic circuits using an analytical solution of the heat equation. Fully three-dimensional analy...
Marcin Janicki, Gilbert De Mey, Andrzej Napieralsk...