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TPDS
1998
13 years 7 months ago
1998
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...
ACSAC
2008
IEEE
14 years 2 months ago
2008
IEEE
Main memory contains transient information for all resident applications. However, if memory chip contents survives power-off, e.g., via freezing DRAM chips, sensitive data such a...
IESS
2007
Springer
14 years 1 months ago
2007
Springer
NoCs present a possible communication infrastructure solution to deal with increased design complexity and shrinking time-to-market. The communication infrastructure is a signific...
DATE
2003
IEEE
14 years 29 days ago
2003
IEEE
This paper presents an efficient methodology for estimating the energy consumption of application programs running on extensible processors. Extensible processors, which are incr...
RTAS
2009
IEEE
14 years 2 months ago
2009
IEEE
In recent years, there has been an increase in video surveillance systems in public and private environments due to a heightened sense of security. The next generation of surveill...