1398 search results - page 167 / 280 » Application-Specific Integrated Circuits |
TVLSI
2010
13 years 2 months ago
2010
Clock network is a vulnerable victim of variations as well as a main power consumer in many integrated circuits. Recently, link-based non-tree clock network attracts people's...
DAC
2005
ACM
14 years 9 months ago
2005
ACM
Placement migration is the movement of cells within an existing placement to address a variety of post-placement design closure issues, such as timing, routing congestion, signal ...
SLIP
2009
ACM
14 years 2 months ago
2009
ACM
Different interconnection structures have been proposed to solve the performance limitation caused by scaling of on-chip global wires. In this paper, we give an overview of curre...
ISQED
2007
IEEE
14 years 2 months ago
2007
IEEE
Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-lev...
ISLPED
2006
ACM
14 years 1 months ago
2006
ACM
All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and ...