1398 search results - page 174 / 280 » Application-Specific Integrated Circuits |
DAC
2006
ACM
14 years 9 months ago
2006
ACM
Increasing resistivity of copper with scaling and rising demands on current density requirements are driving the need to identify new wiring solutions for deep nanometer scale VLS...
ICCAD
2008
IEEE
14 years 4 months ago
2008
IEEE
— To ensure security and robustness of the next generation of Physically Unclonable Functions (PUFs), we have developed a new methodology for PUF design. Our approach employs int...
ICCAD
2006
IEEE
14 years 4 months ago
2006
IEEE
We present the first efficient approach to global routing that takes spacing-dependent costs into account and provably finds a near-optimum solution including these costs. We sh...
ICCAD
2001
IEEE
14 years 4 months ago
2001
IEEE
Interconnect structures including dielectrics can be modeled by an integral equation method using volume currents and surface charges for the conductors, and volume polarization c...
ICCAD
2001
IEEE
14 years 4 months ago
2001
IEEE
— Modern sub-micron VLSI designs include huge power grids that are required to distribute large amounts of current, at increasingly lower voltages. The resulting voltage drop on ...