1398 search results - page 24 / 280 » Application-Specific Integrated Circuits |
ICCAD
2008
IEEE
14 years 7 months ago
2008
IEEE
—To overcome the energy-efficiency limitations imposed by finite sub-threshold slope in CMOS transistors, this paper explores the design of integrated circuits based on nanoelect...
ICCAD
2006
IEEE
14 years 7 months ago
2006
IEEE
Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
ISCAS
2008
IEEE
14 years 4 months ago
2008
IEEE
—We present experimental results from an integrated circuit designed for wireless neural recording applications. The chip, which was fabricated in a 0.6-µm 2P3M BiCMOS process, ...
DATE
2007
IEEE
14 years 4 months ago
2007
IEEE
3D integration of multiple active layers into a single chip is a viable technique that greatly reduces the length of global wires by providing vertical connections between layers....
DELTA
2002
IEEE
14 years 3 months ago
2002
IEEE
Teaching the practical aspects of device and chip design in New Zealand presents many problems, including high manufacturing costs, long lead times, and the lack of local industry...