1398 search results - page 87 / 280 » Application-Specific Integrated Circuits |
ASPDAC
2011
ACM
12 years 12 months ago
2011
ACM
Abstract— Three-dimensional (3D) integration and Networkon-Chip (NoC) are both proposed to tackle the on-chip interconnect scaling problems, and extensive research efforts have b...
ICCAD
2006
IEEE
14 years 5 months ago
2006
IEEE
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...
ISCAS
1999
IEEE
14 years 16 days ago
1999
IEEE
Current mode (ECL) logic has long been the option of choice in those applications requiring logic functions at multigigahertz rates. This trend continues despite the obvious very ...
VTS
2006
IEEE
14 years 2 months ago
2006
IEEE
This paper presents the design and experimental results of fully integrated CMOS power sensors for RF built-in self-test (BIST) applications. Using a standard 0.18- m CMOS process...
ITC
2000
IEEE
14 years 19 days ago
2000
IEEE
An area efficient and robust integrated test core for mixed-signal circuits is described. The core consists of a completely digital implementation, except for a simple reconstructi...