A latchup current self-stop methodology and circuit design, which are used to prevent damage in the bulk CMOS integrated circuits due to latchup, are proposed in this paper. In a ...
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit ar...
This paper presents a method to reduce the complexity of a linear or linearized (small-signal) analog circuit. The reduction technique, based on quality-error ranking, can be used...
Walter Daems, Georges G. E. Gielen, Willy M. C. Sa...
CDM ESD event has become the main ESD reliability concern for integrated-circuits products using nanoscale CMOS technology. A novel CDM ESD protection design, using self-biased cu...