47 search results - page 8 / 10 » Assignment Stack Shrinking |
CODES
2007
IEEE
14 years 1 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
DAC
2005
ACM
14 years 8 months ago
2005
ACM
As feature sizes shrink, transient failures of on-chip network links become a critical problem. At the same time, many applications require guarantees on both message arrival prob...
ICCAD
2008
IEEE
14 years 4 months ago
2008
IEEE
— As transistor sizes continue to shrink and the number of transistors per chip keeps increasing, chip multiprocessors (CMPs) are becoming a promising alternative to remain on th...
PVLDB
2010
13 years 5 months ago
2010
The performance of external sorting using merge sort is highly dependent on the length of the runs generated. One of the most commonly used run generation strategies is Replacemen...
ASPDAC
2007
ACM
13 years 11 months ago
2007
ACM
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...