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HPCA
2007
IEEE
14 years 8 months ago
Thermal Herding: Microarchitecture Techniques for Controlling Hotspots in High-Performance 3D-Integrated Processors
3D integration technology greatly increases transistor density while providing faster on-chip communication. 3D implementations of processors can simultaneously provide both laten...
Kiran Puttaswamy, Gabriel H. Loh
ICCAD
2001
IEEE
143views Hardware» more  ICCAD 2001»
14 years 4 months ago
Transient Power Management Through High Level Synthesis
The use of nanometer technologies is making it increasingly important to consider transient characteristics of a circuit’s power dissipation (e.g., peak power, and power gradien...
Vijay Raghunathan, Srivaths Ravi, Anand Raghunatha...
ASPLOS
2010
ACM
14 years 2 months ago
Conservation cores: reducing the energy of mature computations
Growing transistor counts, limited power budgets, and the breakdown of voltage scaling are currently conspiring to create a utilization wall that limits the fraction of a chip tha...
Ganesh Venkatesh, Jack Sampson, Nathan Goulding, S...
ICPP
2008
IEEE
14 years 2 months ago
Optimizing Issue Queue Reliability to Soft Errors on Simultaneous Multithreaded Architectures
The issue queue (IQ) is a key microarchitecture structure for exploiting instruction-level and thread-level parallelism in dynamically scheduled simultaneous multithreaded (SMT) p...
Xin Fu, Wangyuan Zhang, Tao Li, José A. B. ...
MICRO
2008
IEEE
72views Hardware» more  MICRO 2008»
14 years 1 months ago
Low-power, high-performance analog neural branch prediction
Shrinking transistor sizes and a trend toward low-power processors have caused increased leakage, high per-device variation and a larger number of hard and soft errors. Maintainin...
Renée St. Amant, Daniel A. Jiménez, ...