Sciweavers

1343 search results - page 130 / 269
» Bounded-lifetime integrated circuits
Sort
View
DAC
2005
ACM
15 years 6 months ago
Design methodology for IC manufacturability based on regular logic-bricks
Implementing logic blocks in an integrated circuit in terms of repeating or regular geometry patterns [6,7] can provide significant advantages in terms of manufacturability and de...
V. Kheterpal, V. Rovner, T. G. Hersan, D. Motiani,...
DAC
2010
ACM
15 years 2 months ago
Tradeoff analysis and optimization of power delivery networks with on-chip voltage regulation
Integrating a large number of on-chip voltage regulators holds the promise of solving many power delivery challenges through strong local load regulation and facilitates systemlev...
Zhiyu Zeng, Xiaoji Ye, Zhuo Feng, Peng Li
DAC
2011
ACM
14 years 4 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
276
Voted
DAC
2011
ACM
14 years 4 months ago
Fault-tolerant 3D clock network
Clock tree synthesis is one of the most important and challenging problems in 3D ICs. The clock signals have to be delivered by through-silicon vias (TSVs) to different tiers with...
Chiao-Ling Lung, Yu-Shih Su, Shih-Hsiu Huang, Yiyu...
DAC
2009
ACM
16 years 5 months ago
Spectral techniques for high-resolution thermal characterization with limited sensor data
Elevated chip temperatures are true limiters to the scalability of computing systems. Excessive runtime thermal variations compromise the performance and reliability of integrated...
Ryan Cochran, Sherief Reda