Implementing logic blocks in an integrated circuit in terms of repeating or regular geometry patterns [6,7] can provide significant advantages in terms of manufacturability and de...
V. Kheterpal, V. Rovner, T. G. Hersan, D. Motiani,...
Integrating a large number of on-chip voltage regulators holds the promise of solving many power delivery challenges through strong local load regulation and facilitates systemlev...
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Clock tree synthesis is one of the most important and challenging problems in 3D ICs. The clock signals have to be delivered by through-silicon vias (TSVs) to different tiers with...
Chiao-Ling Lung, Yu-Shih Su, Shih-Hsiu Huang, Yiyu...
Elevated chip temperatures are true limiters to the scalability of computing systems. Excessive runtime thermal variations compromise the performance and reliability of integrated...