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DAC
2009
ACM
14 years 2 months ago
Accurate temperature estimation using noisy thermal sensors
Multicore SOCs rely on runtime thermal measurements using on-chip sensors for DTM. In this paper we address the problem of estimating the actual temperature of on-chip thermal sen...
Yufu Zhang, Ankur Srivastava
ISPD
2009
ACM
112views Hardware» more  ISPD 2009»
14 years 2 months ago
Post-floorplanning power/ground ring synthesis for multiple-supply-voltage designs
The multiple-supply voltage (MSV) design style has been extensively applied to mitigate dynamic-power consumption. The MSV design paradigm, however, brings many crucial challenges...
Wan-Ping Lee, Diana Marculescu, Yao-Wen Chang
DATE
2009
IEEE
114views Hardware» more  DATE 2009»
14 years 2 months ago
Hardware aging-based software metering
Abstract—Reliable and verifiable hardware, software and content usage metering (HSCM) are of primary importance for wide segments of e-commerce including intellectual property a...
Foad Dabiri, Miodrag Potkonjak
DATE
2009
IEEE
215views Hardware» more  DATE 2009»
14 years 2 months ago
EMC-aware design on a microcontroller for automotive applications
In modern digital ICs, the increasing demand for performance and throughput requires operating frequencies of hundreds of megahertz, and in several cases exceeding the gigahertz r...
Patrice Joubert Doriol, Yamarita Villavicencio, Cr...
GLVLSI
2009
IEEE
189views VLSI» more  GLVLSI 2009»
14 years 2 months ago
High-performance, cost-effective heterogeneous 3D FPGA architectures
In this paper, we propose novel architectural and design techniques for three-dimensional field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop a...
Roto Le, Sherief Reda, R. Iris Bahar