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DAC
2011
ACM
12 years 8 months ago
Non-uniform micro-channel design for stacked 3D-ICs
Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with m...
Bing Shi, Ankur Srivastava, Peng Wang
FPT
2005
IEEE
134views Hardware» more  FPT 2005»
14 years 2 months ago
Post-Silicon Debug Using Programmable Logic Cores
Producing a functionally correct integrated circuit is becoming increasingly difficult. No matter how careful a designer is, there will always be integrated circuits that are fabr...
Bradley R. Quinton, Steven J. E. Wilton
VLSID
2004
IEEE
75views VLSI» more  VLSID 2004»
14 years 8 months ago
Quantitative Model for Thermal Behaviour of an Analog Integrated Circuit
Gagandeep S. Sandha, Pawan K. Singh, C. Pradeep Ku...
ISCAS
2008
IEEE
170views Hardware» more  ISCAS 2008»
14 years 2 months ago
Integrated circuit implementation of a cortical neuron
— This paper presents an analogue integrated circuit implementation of a cortical neuron model. The VLSI chip prototype has been implemented in a 0.35 µm CMOS technology. The si...
Jayawan H. B. Wijekoon, Piotr Dudek
GLVLSI
2006
IEEE
115views VLSI» more  GLVLSI 2006»
14 years 2 months ago
Yield enhancement of asynchronous logic circuits through 3-dimensional integration technology
This paper presents a systematic design methodology for yield enhancement of asynchronous logic circuits using 3-D (3-Dimensional) integration technology. In this design, the targ...
Song Peng, Rajit Manohar