A new approach for inserting repeaters in 3-D interconnects is proposed. The allocation of repeaters along an interplane interconnect is iteratively determined. The proposed approa...
This paper presents an optimized fault diagnosing procedure applicable in Built-in Self-Test environments. Instead of the known approach based on a simple bisection of patterns in...
Raimund Ubar, Sergei Kostin, Jaan Raik, Teet Evart...
Suppression of leakage current and reduction in device-todevice variability will be key challenges for sub-45nm CMOS technologies. Non-classical transistor structures such as the ...
Decreasing feature sizes and increasing package densities are making thermal issues extremely important in IC design. Uneven thermal maps and hot spots in ICs cause physical stres...
— The inductive characteristics of several types of gridded power distribution networks are described in this paper. The inductance extraction program FastHenry is used to evalua...