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CODES
2007
IEEE
14 years 2 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
CODES
2007
IEEE
14 years 2 months ago
2007
IEEE
Multiple wireless technologies are converging to run on personal handhelds. The plethora of communication standards next to the cost issues of deeper submicron processing require ...
DATE
2007
IEEE
14 years 2 months ago
2007
IEEE
Error-tolerance is an innovative way to enhance the effective yield of IC products. Previously a test methodology based on error-rate estimation to support error-tolerance was pro...
FOCS
2007
IEEE
14 years 2 months ago
2007
IEEE
We consider a variant of the classic multi-armed bandit problem (MAB), which we call FEEDBACK MAB, where the reward obtained by playing each of n independent arms varies according...
HICSS
2007
IEEE
14 years 2 months ago
2007
IEEE
In this paper we described the findings based on a research study on current Enterprise Information Architecture (EIA) practices in Malaysian organizations. Ten organizations from...