In the era of deep sub-wavelength lithography for nanometer VLSI designs, manufacturability and yield issues are critical and need to be addressed during the key physical design i...
In this paper, we present ELIAD, an efficient lithography aware detailed router to optimize silicon image after optical proximity correction (OPC) in a correct-by-construction man...
This paper proposes a scheme for automatic re-distribution layer (RDL) routing, which is used in chip-package connections. Traditional RDL routing designs are mostly performed man...
The flip-chip package provides a high chip-density solution to the demand for more I/O pads of VLSI designs. In this paper, we present the first routing algorithm in the literatur...