65 search results - page 9 / 13 » Compact Reduced Order Modeling for Multiple-Port Interconnec... |
ICCD
2006
IEEE
14 years 4 months ago
2006
IEEE
— New back-end design for manufacturability rules have brought guarantee rules for interconnect matching. These rules indicate a certain capacitance matching guarantee given spac...
DATE
2002
IEEE
14 years 19 days ago
2002
IEEE
The relative tolerances for interconnect and device parameter variations have not scaled with feature sizes which have brought about significant performance variability. As we sca...
ICCAD
2004
IEEE
14 years 4 months ago
2004
IEEE
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...
QEST
2010
IEEE
13 years 5 months ago
2010
IEEE
The importance of the order two Markovian arrival process (MAP(2)) comes from its compactness, serving either as arrival or service process in applications, and from the nice prope...
ISCA
1992
IEEE
13 years 11 months ago
1992
IEEE
Relaxed memory consistency models, such as release consistency, were introduced in order to reduce the impact of remote memory access latency in both software and hardware distrib...