— The influence of interconnects on processor performance and cost is becoming increasingly pronounced with technology scaling. In this paper, we present a fast compression sche...
Jiangjiang Liu, Krishnan Sundaresan, Nihar R. Maha...
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...
Contention for shared resources on multicore processors remains an unsolved problem in existing systems despite significant research efforts dedicated to this problem in the past...
Sergey Zhuravlev, Sergey Blagodurov, Alexandra Fed...
In order to help users navigate an image search system, one could provide explicit information on a small set of images as to which of them are relevant or not to their task. Thes...