In this paper, we present various challenges that arise in the delivery and exchange of multimedia information to mobile devices. Specifically, we focus on techniques for maintain...
Hans Van Antwerpen, Nikil D. Dutt, Rajesh K. Gupta...
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
Multiple clock cycles are needed to cross the global interconnects for multi-gigahertz designs in nanometer technologies. For synchronous designs, this requires retiming and pipel...
Reversible quantum logic plays an important role in quantum computing. In this paper, we propose an approach to optimally synthesize quantum circuits by symbolic reachability anal...
William N. N. Hung, Xiaoyu Song, Guowu Yang, Jin Y...
Architectural decisions for DSP modules are often analyzed using high level C models. Such high-level explorations allow early examination of the algorithms and the architectural ...