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DAC
2011
ACM
12 years 7 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
ECBS
2005
IEEE
93views Hardware» more  ECBS 2005»
14 years 1 months ago
Embedded System Engineering Using C/C++ Based Design Methodologies
This paper analyzes and compares the effectiveness of various system level design methodologies in assessing performance of embedded computing systems from the earliest stages of ...
Claudio Talarico, Aseem Gupta, Ebenezer Peter, Jer...
JSC
2007
72views more  JSC 2007»
13 years 7 months ago
Linear syntax for communicating elementary mathematics
We consider computer aided assessment (CAA) of mathematics in which a student provides an answer in the form of a mathematical expression. A common approach is for CAA system impl...
Christopher J. Sangwin, P. Ramsden
MOC
2000
137views more  MOC 2000»
13 years 7 months ago
The apolar bilinear form in geometric modeling
Some recent methods of Computer Aided Geometric Design are related to the apolar bilinear form, an inner product on the space of homogeneous multivariate polynomials of a fixed deg...
Gert Vegter
IJCPOL
2006
106views more  IJCPOL 2006»
13 years 7 months ago
Court Stenography-to-Text ("stt") in Hong Kong: a Jurilinguistic Engineering Effort
Implementation of legal bilingualism in Hong Kong after 1997 has necessitated the production of voluminous and extensive court proceedings and judgments in both Chinese and Englis...
Benjamin K. Tsou, Tom B. Y. Lai, K. K. Sin, Lawren...