Several features such as reconfiguration, voltage and frequency scaling, low-power operating states, duty-cycling, etc. are exploited for latency and energy efficient application ...
Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (N...
Abstract--Due to technology or policy constraints, communications across network domains usually require the intervention of gateways, and their proper deployment is crucial to the...
Ting He, Kang-Won Lee, Nikoletta Sofra, Kin K. Leu...
Memory-processor integration o ers new opportunities for reducing the energy of a system. In the case of embedded systems, one solution consists of mapping the most frequently acc...
In recent years, the increasing number of processor cores and limited increases in main memory bandwidth have led to the problem of the bandwidth wall, where memory bandwidth is b...
Guangyu Sun, Christopher J. Hughes, Changkyu Kim, ...