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TCAD
2008
167views more  TCAD 2008»
13 years 7 months ago
System-Level Dynamic Thermal Management for High-Performance Microprocessors
Abstract--Thermal issues are fast becoming major design constraints in high-performance systems. Temperature variations adversely affect system reliability and prompt worst-case de...
Amit Kumar 0002, Li Shang, Li-Shiuan Peh, Niraj K....
CAI
2006
Springer
13 years 7 months ago
Addressing the Conflicting Dimension of Groupware: A Case Study in Software Requirements Validation
This paper addresses the conflicting dimension of groupware, seeking the reconciliation of two very different assumptions about the users' attitudes using groupware tools: use...
Pedro Antunes, João Ramires, Ana Resp&iacut...
CASES
2005
ACM
13 years 9 months ago
Software-directed power-aware interconnection networks
Interconnection networks have been deployed as the communication fabric in a wide range of parallel computer systems. With recent technological trends allowing growing quantities ...
Vassos Soteriou, Noel Eisley, Li-Shiuan Peh
CODES
2003
IEEE
14 years 1 months ago
Early estimation of the size of VHDL projects
The analysis of the amount of human resources required to complete a project is felt as a critical issue in any company of the electronics industry. In particular, early estimatin...
William Fornaciari, Fabio Salice, Daniele Paolo Sc...
DAC
2001
ACM
14 years 8 months ago
MetaCores: Design and Optimization Techniques
Currently, hardware intellectual property (IP) is delivered at vels of abstraction: hard, firm, and soft. In order to further enhance performance, efficiency, and flexibility of I...
Seapahn Meguerdichian, Farinaz Koushanfar, Advait ...