162 search results - page 18 / 33 » Design Considerations for Optically Connected Systems on Chi... |
DAC
2006
ACM
14 years 9 months ago
2006
ACM
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
NOCS
2009
IEEE
14 years 2 months ago
2009
IEEE
Design Constraints imposed by global interconnect delays as well as limitations in integration of disparate technologies make 3-D chip stacks an enticing technology solution for m...
DATE
2009
IEEE
14 years 2 months ago
2009
IEEE
Current trends in technology scaling foreshadow worsening transistor reliability as well as greater numbers of transistors in each system. The combination of these factors will so...
WACV
2002
IEEE
14 years 25 days ago
2002
IEEE
This paper describes design and implementation of a vision based platform for automated refueling tasks. The platform is an autonomous docking system in principle, with the specif...
IPPS
2007
IEEE
14 years 2 months ago
2007
IEEE
The rapid revolution in microprocessor chip architecture due to multicore technology is presenting unprecedented challenges to the application developers as well as system softwar...