434 search results - page 27 / 87 » Design Methodologies and Architecture Solutions for High-Per... |
DAC
1999
ACM
14 years 1 days ago
1999
ACM
As the family of Alpha microprocessors continues to scale into more advanced technologies with very high frequency edge rates and multiple layers of interconnect, the issue of cha...
SLIP
2009
ACM
14 years 2 months ago
2009
ACM
A novel high-level approach for estimating power consumption of global interconnects in data-path oriented designs implemented in FPGAs is presented. The methodology is applied to...
VLSID
2010
IEEE
13 years 6 months ago
2010
IEEE
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, is one of the promising solutions to mitigate the interconnect...
PPL
2008
13 years 7 months ago
2008
As the number of integrated IP cores in the current System-on-Chips (SoCs) keeps increasing, communication requirements among cores can not be sufficiently satisfied using either ...
IJES
2007
13 years 7 months ago
2007
: The power density in high performance systems continues to rise with every process technology generation, thereby increasing the operating temperature and creating ‘hot spotsâ€...