96 search results - page 14 / 20 » Design Methodology Innovations Address Manufacturing Technol... |
ICCAD
2006
IEEE
14 years 4 months ago
2006
IEEE
Process variations in modern VLSI technologies are growing in both magnitude and dimensionality. To assess performance variability, complex simulation and performance models param...
MIDDLEWARE
2005
Springer
14 years 1 months ago
2005
Springer
Currently, the interest in Ambient Intelligence (or AmI) has increased exponentially due to the widespread use of portable devices. Users demand more and more functionality from t...
ICCD
2006
IEEE
14 years 4 months ago
2006
IEEE
— As silicon CMOS devices are scaled down into the nanoscale regime, new challenges at both the device and system level are arising. While some of these challenges will be overco...
ICCAD
2009
IEEE
13 years 5 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
ARC
2008
Springer
13 years 9 months ago
2008
Springer
Over the last years, we have witnessed the increased use of Application-Specific Instruction-Set Processors (ASIPs). These ASIPs are processors that have a customizable instruction...