109 search results - page 15 / 22 » Design Methodology and Manufacture of a Microinductor |
GLVLSI
2009
IEEE
14 years 2 months ago
2009
IEEE
In this paper, we propose novel architectural and design techniques for three-dimensional field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop a...
Publication
In this paper, we consider a decentralized supply chain formation problem for linear, multi-echelon supply chains when the managers of the individual echelons are autonomous, ratio...
DATE
2000
IEEE
13 years 11 months ago
2000
IEEE
Novel methodology and algorithms to seamlessly integrate logic synthesis and physical placement through a transformational approach are presented. Contrary to most placement algor...
DAC
2004
ACM
14 years 8 months ago
2004
ACM
Long design cycles due to the inability to predict silicon realities is a well-known problem that plagues analog/RF integrated circuit product development. As this problem worsens...
FTEDA
2006
13 years 7 months ago
2006
As IC technologies scale to finer feature sizes, it becomes increasingly difficult to control the relative process variations. The increasing fluctuations in manufacturing process...