33 search results - page 1 / 7 » Design for manufacturability and reliability for TSV-based 3... |
ASPDAC
2012
ACM
12 years 6 months ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
ASPDAC
2010
ACM
13 years 9 months ago
2010
ACM
GLVLSI
2009
IEEE
13 years 8 months ago
2009
IEEE
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (...
DAC
2012
ACM
12 years 1 months ago
2012
ACM
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
DAC
2011
ACM
12 years 10 months ago
2011
ACM
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...