46 search results - page 5 / 10 » Design optimizations for microprocessors at low temperature |
ICCD
2005
IEEE
14 years 4 months ago
2005
IEEE
Designing temperature-aware microarchitectures for microprocessors at new technologies is becoming a critical requirement due to the exponentially increasing on-chip power density...
ISQED
2008
IEEE
14 years 1 months ago
2008
IEEE
In multi-core processors there are several ways to pair a thread to a particular core. These load-balancing techniques result in a quite different power, performance and thermal b...
FTEDA
2008
13 years 7 months ago
2008
With greater integration, the power dissipation in integrated circuits has begun to outpace the ability of today's heat sinks to limit the on-chip temperature. As a result, t...
DATE
2009
IEEE
14 years 2 months ago
2009
IEEE
—Localized heating-up creates thermal hotspots across the chip, with the integer register file ranked as the hottest unit in high-performance microprocessors. In this paper, we ...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
Traditionally, at early design stages, leakage power is associated with the number of transistors in a design. Hence, intuitively an implementation with minimum resource usage wou...