4340 search results - page 117 / 868 » Designing for change |
131
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ICCAD
2010
IEEE
15 years 1 months ago
2010
IEEE
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
152
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ESWA
2008
15 years 3 months ago
2008
The severe competition in the market has driven enterprises to produce a wider variety of products to meet consumers' needs. However, frequent variation of product specificat...
109
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AIED
2007
Springer
15 years 10 months ago
2007
Springer
: This paper reports a study that evaluated a methodology and tool for eliciting the emotional experience of language learning. It has looked at the relative rate of change of diff...
117
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ISCA
2007
IEEE
15 years 10 months ago
2007
IEEE
The ever increasing sizes of on-chip caches and the growing domination of wire delay necessitate significant changes to cache hierarchy design methodologies. Many recent proposal...
132
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TCAD
1998
15 years 3 months ago
1998
Conventional scan design imposes considerable area and delay overhead by using larger scan
ip-
ops and additional scan wires without utilizing the functionality of the combinatio...