4340 search results - page 134 / 868 » Designing for change |
125
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ICCAD
2005
IEEE
16 years 28 days ago
2005
IEEE
— The flip-chip package gives the highest chip density of any packaging method to support the pad-limited Application-Specific Integrated Circuit (ASIC) designs. In this paper,...
126
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CHI
2010
ACM
15 years 11 months ago
2010
ACM
Eco-feedback technology provides feedback on individual or group behaviors with a goal of reducing environmental impact. The history of eco-feedback extends back more than 40 year...
143
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SIGCSE
2010
ACM
15 years 11 months ago
2010
ACM
A significant focus in the United States recently has been to increase engagement and interest in STEM curricula, particularly among girls and underrepresented minorities [3]. In ...
129
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ICRA
2008
IEEE
15 years 10 months ago
2008
IEEE
— How to teach actions to a robot as well as how a robot learns actions is an important issue to be discussed in designing robot learning systems. Inspired by human parentinfant ...
ISCAS
2006
IEEE
15 years 10 months ago
2006
IEEE
In this paper, we propose a cost-effective reconfigurable accelerator for the platform-based system-on-a-chip (SoC) design. Based on the proposed design methodology, the reconfigu...