— As across-chip wire delays exceed a clock cycle, interconnect pipelining becomes essential. However, the arbitrary insertion of flip-flops can change the differentials of lat...
— As microprocessor technology continues to scale into the nanometer regime, recent studies show that interconnect delay will be a limiting factor for performance, and multiple c...
The design of high-throughput large-state Viterbi decoders relies on the use of multiple arithmetic units. The global communication channels among these parallel processors often ...
The existence of non-uniform thermal gradients on the substrate in high performance IC’s can significantly impact the performance of global on-chip interconnects. This issue is...
Multiple clock cycles are needed to cross the global interconnects for multi-gigahertz designs in nanometer technologies. For synchronous designs, this requires retiming and pipel...