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ISCAS
2005
IEEE
158views Hardware» more  ISCAS 2005»
14 years 4 months ago
Designing optimized pipelined global interconnects: algorithms and methodology impact
— As across-chip wire delays exceed a clock cycle, interconnect pipelining becomes essential. However, the arbitrary insertion of flip-flops can change the differentials of lat...
Vidyasagar Nookala, Sachin S. Sapatnekar
ASPDAC
2005
ACM
100views Hardware» more  ASPDAC 2005»
14 years 26 days ago
Microarchitecture evaluation with floorplanning and interconnect pipelining
— As microprocessor technology continues to scale into the nanometer regime, recent studies show that interconnect delay will be a limiting factor for performance, and multiple c...
Ashok Jagannathan, Hannah Honghua Yang, Kris Konig...
DAC
2002
ACM
14 years 12 months ago
Design of a high-throughput low-power IS95 Viterbi decoder
The design of high-throughput large-state Viterbi decoders relies on the use of multiple arithmetic units. The global communication channels among these parallel processors often ...
Xun Liu, Marios C. Papaefthymiou
DATE
2006
IEEE
87views Hardware» more  DATE 2006»
14 years 5 months ago
Thermal resilient bounded-skew clock tree optimization methodology
The existence of non-uniform thermal gradients on the substrate in high performance IC’s can significantly impact the performance of global on-chip interconnects. This issue is...
Ashutosh Chakraborty, Prassanna Sithambaram, Karth...
DAC
2003
ACM
14 years 12 months ago
Multilevel global placement with retiming
Multiple clock cycles are needed to cross the global interconnects for multi-gigahertz designs in nanometer technologies. For synchronous designs, this requires retiming and pipel...
Jason Cong, Xin Yuan