—Increasing power density causes die overheating due to limited cooling capacity of the package. Conventional thermal management techniques e.g. logic shutdown, clock gating, fre...
– Interconnect issues are becoming increasingly important for ULSI systems. IntSim, an interconnect CAD tool, has been developed to obtain pitches of different wiring levels and ...
Deepak C. Sekar, Azad Naeemi, Reza Sarvari, Jeffre...
The high leakage current in nano-meter regimes is becoming a significant portion of power dissipation in CMOS circuits as threshold voltage, channel length, and gate oxide thickne...
Amit Agarwal, Chris H. Kim, Saibal Mukhopadhyay, K...
Non-uniform utilization of functional units in combination with hardware mechanisms such as clock gating leads to different power consumptions in different parts of a processor ch...
Microprocessor designers use techniques such as clock gating to reduce power dissipation. An unfortunate side-effect of these techniques is the processor current fluctuations th...