26 search results - page 3 / 6 » Distributing the Frontend for Temperature Reduction |
ICML
2007
IEEE
14 years 8 months ago
2007
IEEE
We study the problem of discovering a manifold that best preserves information relevant to a nonlinear regression. Solving this problem involves extending and uniting two threads ...
DATE
2008
IEEE
14 years 2 months ago
2008
IEEE
This paper presents a method of dynamic voltage scaling (DVS) that tackles both switching and leakage power with combined Vdd/Vbs scaling and gives minimum average energy consumpt...
HPCA
2007
IEEE
14 years 8 months ago
2007
IEEE
3D integration technology greatly increases transistor density while providing faster on-chip communication. 3D implementations of processors can simultaneously provide both laten...
ISPD
2005
ACM
14 years 1 months ago
2005
ACM
In the nanometer VLSI technology, the variation effects like manufacturing variation, power supply noise, temperature etc. become very significant. As one of the most vital nets...
DAC
2011
ACM
12 years 7 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...