239 search results - page 45 / 48 » Energy benchmarks: a detailed analysis |
DAC
2006
ACM
14 years 8 months ago
2006
ACM
Due to the shrinking of feature size and reduction in supply voltages, nanoscale circuits have become more susceptible to radiation induced transient faults. In this paper, we pre...
POPL
2007
ACM
14 years 7 months ago
2007
ACM
A memory leak in a garbage-collected program occurs when the program inadvertently maintains references to objects that it no longer needs. Memory leaks cause systematic heap grow...
RECOMB
2006
Springer
14 years 7 months ago
2006
Springer
mRNA molecules are folded in the cells and therefore many of their substrings may actually be inaccessible to protein and microRNA binding. The need to apply an accessability crite...
ISCA
2009
IEEE
14 years 2 months ago
2009
IEEE
Analysis of technology and application trends reveals a growing imbalance in the peak compute-to-memory-capacity ratio for future servers. At the same time, the fraction contribut...
CODES
2007
IEEE
14 years 1 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...