The rapid growth of location-based applications has spurred extensive research on localization. Nonetheless, indoor localization remains an elusive problem mostly because the accu...
Souvik Sen, Romit Roy Choudhury, Srihari Nelakudit...
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
Power delivery is a growing reliability concern in microprocessors as the industry moves toward feature-rich, powerhungrier designs. To battle the ever-aggravating power consumpti...
Fayez Mohamood, Michael B. Healy, Sung Kyu Lim, Hs...
— In this paper, we examine the impact of application task mapping on the reliability of MPSoC in the presence of single-event upsets (SEUs). We propose a novel soft erroraware d...
Rishad A. Shafik, Bashir M. Al-Hashimi, Krishnendu...