Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
There is an increased dominance of intra-die process variations, creating a need for an accurate and fast statistical timing analysis. Most of the recent proposed approaches assum...
A component framework plays an important role in CBSD as it determines how software components are developed, packaged, assembled and deployed. A desirable component framework for...
Chetan Raj, Jiyong Park, Jungkeun Park, Seongsoo H...
To date, topology control in wireless ad hoc and sensor networks--the study of how to compute from the given communication network a subgraph with certain beneficial properties--h...
Thomas Moscibroda, Roger Wattenhofer, Aaron Zollin...
—With every process generation, the problem of variability in physical parameters and environmental conditions poses a great challenge to the design of fast and reliable circuits...
Shrikanth Ganapathy, Ramon Canal, Antonio Gonz&aac...