Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
M. Puech, Jean-Marc Thevenoud, J. M. Gruffat, N. L...
—3D integration is a key solution to the predicted performance increase of future electronic systems. It offers extreme miniaturization and fabrication of More than Moore product...
Abstract-Two dimensional (2D) integration has been the traditional approach for IC integration. Increasing demands for providing electronic devices with superior performance and fu...
We fabricated a 3D-integrated multi-chip sensor separate dies [9]. In this paper, we present a 3D integrated and actuator and demonstrated the ability of communication with tempera...
— We designed a 3D integrated multi-chip module that uses non-galvanic capacitive coupling to provide bi-directional communication and exchange power supply between two separate ...