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DAC
2011
ACM
12 years 7 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
CF
2006
ACM
14 years 1 months ago
A nano-scale reconfigurable mesh with spin waves
In this paper, we present a nano-scale reconfigurable mesh that is interconnected with ferromagnetic spin-wave buses. The architecture described here, while requiring the same num...
Mary Mehrnoosh Eshaghian-Wilner, Alexander Khitun,...
ISLPED
2009
ACM
125views Hardware» more  ISLPED 2009»
14 years 1 months ago
Behavior-level observability don't-cares and application to low-power behavioral synthesis
Many techniques for power management employed in advanced RTL synthesis tools rely explicitly or implicitly on observability don’t-care (ODC) conditions. In this paper we presen...
Jason Cong, Bin Liu, Zhiru Zhang
DAC
2005
ACM
13 years 9 months ago
Efficient and accurate gate sizing with piecewise convex delay models
We present an efficient and accurate gate sizing tool that employs a novel piecewise convex delay model, handling both rise and fall delays, for static CMOS gates. The delay model...
Hiran Tennakoon, Carl Sechen
VLSID
2008
IEEE
128views VLSI» more  VLSID 2008»
14 years 7 months ago
Addressing the Challenges of Synchronization/Communication and Debugging Support in Hardware/Software Cosimulation
With increasing adoption of Electronic System Level (ESL) tools, effective design and validation time has reduced to a considerable extent. Cosimulation is found to be a principal...
Banit Agrawal, Timothy Sherwood, Chulho Shin, Simo...