Clock tree synthesis is one of the most important and challenging problems in 3D ICs. The clock signals have to be delivered by through-silicon vias (TSVs) to different tiers with...
Chiao-Ling Lung, Yu-Shih Su, Shih-Hsiu Huang, Yiyu...
Defect and fault tolerance is being studied in a 3D Heterogeneous Sensor using a stacked chip with sensors located on the top plane, and inter-plane vias connecting these to other...
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
A 3D Heterogeneous Sensor using a stacked chip is investigated. Optical Active Pixel Sensor and IR Bolometer detectors are combined to create a multispectral pixel for aligned col...
Mesh networks are among the most important interconnection network topologies for large multicomputer systems. Mesh networks perform poorly in tolerating faults in the view of wor...
Jianer Chen, Gaocai Wang, Chuang Lin, Tao Wang, Gu...