172 search results - page 34 / 35 » FinFET-based SRAM design |
MICRO
2006
IEEE
14 years 1 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
IOLTS
2005
IEEE
14 years 1 months ago
2005
IEEE
As device geometries continue to shrink, single event upsets are becoming of concern to a wider spectrum of system designers. These “soft errors” can be a nuisance or catastro...
ANCS
2005
ACM
14 years 1 months ago
2005
ACM
High-speed packet content inspection and filtering devices rely on a fast multi-pattern matching algorithm which is used to detect predefined keywords or signatures in the packe...
SIGCOMM
2004
ACM
14 years 26 days ago
2004
ACM
All Internet routers contain buffers to hold packets during times of congestion. Today, the size of the buffers is determined by the dynamics of TCP’s congestion control algor...
ITC
2003
IEEE
14 years 22 days ago
2003
IEEE
Embedded memories are among the most widely used cores in current system-on-chip (SOC) implementations. Memory cores usually occupy a significant portion of the chip area, and do...