531 search results - page 60 / 107 » Formal Methods for Networks on Chips |
TKDE
2012
11 years 11 months ago
2012
—Continuous queries are used to monitor changes to time varying data and to provide results useful for online decision making. Typically a user desires to obtain the value of som...
ICCAD
2005
IEEE
14 years 5 months ago
2005
IEEE
— The flip-chip package gives the highest chip density of any packaging method to support the pad-limited Application-Specific Integrated Circuit (ASIC) designs. In this paper,...
FPL
2005
Springer
14 years 2 months ago
2005
Springer
A parallel MPEG-4 Simple Profile encoder for FPGA based multiprocessor System-on-Chip (SOC) is presented. The goal is a computationally scalable framework independent of platform....
ASPDAC
2009
ACM
14 years 1 months ago
2009
ACM
— In three-dimensional (3D) chips, the amount of supply current per package pin is significantly more than in two-dimensional (2D) designs. Therefore, the power supply noise pro...
TCAD
2008
13 years 8 months ago
2008
Abstract--This paper proposes an adaptive watermarking technique by modulating some closed cones in an originally optimized logic network (master design) for technology mapping. Th...