The electrostatic discharge (ESD) problem has become a challenging reliability issue in nanometer circuit design. High voltages resulted from ESD might cause high current densitie...
In deep submicron VLSI circuits, interconnect reliability due to electromigration and thermal effects is fast becoming a serious design issue particularly for long signal lines. T...
This paper presents a two-step, RC-interconnect insensitive linear time-varying (LTV) driver model for gate-level timing calculation. We show how to characterize a driver with the...
At ACISP 2004, Giraud and Knudsen presented the first fault analysis of DSA, ECDSA, XTR-DSA, Schnorr and ElGamal signatures schemes that considered faults affecting one byte. The...
Christophe Giraud, Erik Woodward Knudsen, Michael ...
The design and analysis of today’s complex real-time systems requires advanced methods. Due to ever growing functionality, hardware complexity and component interaction, applyin...