6 search results - page 1 / 2 » From 3D circuit technologies and data structures to intercon... |
SLIP
2009
ACM
14 years 2 months ago
2009
ACM
New technologies such as 3D integration are becoming a new force that is keeping Moore’s law in effect in today’s nano era. By adding a third dimension in current 2D circuits...
ICCAD
2006
IEEE
14 years 4 months ago
2006
IEEE
Capacitive interconnections are very promising structures for high-speed and low-power signaling in 3D packages. Since the performance of AC links, in terms of Band-Width and Bit-...
MICRO
2008
IEEE
14 years 1 months ago
2008
IEEE
— As semiconductor processing techniques continue to scale down, transient faults, also known as soft errors, are increasingly becoming a reliability threat to high-performance m...
DAC
2000
ACM
14 years 8 months ago
2000
ACM
Continuous scaling of VLSI circuits is reducing gate delays but rapidly increasing interconnect delays. Semiconductor Industry Association (SIA) roadmap predicts that, beyond the ...
DAC
2006
ACM
14 years 8 months ago
2006
ACM
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...