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ICCAD
2003
IEEE
14 years 4 months ago
2003
IEEE
Ultra-deep submicron manufacturability impacts physical design (PD) through complex layout rules and large guardbands for process variability; this creates new requirements for ne...
ICCAD
2003
IEEE
14 years 4 months ago
2003
IEEE
— In this paper, we present a high-level power model to estimate the power consumption in semi-global and global interconnects. Such interconnects are used for communications bet...
ICCAD
2003
IEEE
14 years 4 months ago
2003
IEEE
DNA probe arrays have emerged as a core genomic technology that enables cost-effective gene expression monitoring, mutation detection, single nucleotide polymorphism analysis and ...
ISPD
2010
ACM
14 years 2 months ago
2010
ACM
In the nanometer IC design, dummy fill is often performed to improve layout pattern uniformity and the post-CMP quality. However, filling dummies might greatly increase intercon...
DATE
2009
IEEE
14 years 2 months ago
2009
IEEE
—1As technology scales, the aging effect caused by Negative Bias Temperature Instability (NBTI) has become a major reliability concern for circuit designers. On the other hand, r...