Future process nodes have such small feature sizes that there will be an increase in the number of manufacturing defects per die. For large FPGAs, it will be critical to tolerate ...
Advanced CAD tools and high-density VLSI technologies have combined to create a new market for reusable digital designs. The economic viability of the new core-based design paradig...
John Lach, William H. Mangione-Smith, Miodrag Potk...
—Time-dependent performance degradation due to transistor aging caused by mechanisms such as Negative Bias Temperature Instability (NBTI) and Hot Carrier Injection (HCI) is one o...
In this paper, we propose novel architectural and design techniques for three-dimensional field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop a...
Aggressive scaling of technology has an adverse impact on the reliability of VLSI circuits. Apart from increasing transient error susceptibility, the circuits also become more vul...