Future process nodes have such small feature sizes that there will be an increase in the number of manufacturing defects per die. For large FPGAs, it will be critical to tolerate ...
Thermal gradients across the die are becoming increasingly prominent as we scale further down into the sub-nanometer regime. While temperature was never a primary concern, its non...
The existence of non-uniform thermal gradients on the substrate in high performance IC’s can significantly impact the performance of global on-chip interconnects. This issue is...
Process variations have become a key concern of circuit designers because of their significant, yet hard to predict impact on performance and signal integrity of VLSI circuits. St...
The next generation of computer chips will continue the trend for more complexity than their predecessors. Many of them will contain different chip technologies and are termed SoC...