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DAC
2006
ACM
14 years 8 months ago
A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...
DAC
2008
ACM
14 years 8 months ago
Analysis and implications of parasitic and screening effects on the high-frequency/RF performance of tunneling-carbon nanotube F
Intrinsic and parasitic capacitances play an important role in determining the high?frequency RF performance of devices. Recently, a new type of carbon nanotube field effect trans...
Chaitanya Kshirsagar, Mohamed N. El-Zeftawi, Kaust...
ASPDAC
2006
ACM
137views Hardware» more  ASPDAC 2006»
14 years 1 months ago
Parameterized block-based non-gaussian statistical gate timing analysis
As technology scales down, timing verification of digital integrated circuits becomes an increasingly challenging task due to the gate and wire variability. Therefore, statistical...
Soroush Abbaspour, Hanif Fatemi, Massoud Pedram
NIPS
2003
13 years 9 months ago
A Mixed-Signal VLSI for Real-Time Generation of Edge-Based Image Vectors
A mixed-signal image filtering VLSI has been developed aiming at real-time generation of edge-based image vectors for robust image recognition. A four-stage asynchronous median de...
Masakazu Yagi, Hideo Yamasaki, Tadashi Shibata
MICRO
2007
IEEE
144views Hardware» more  MICRO 2007»
14 years 1 months ago
Process Variation Tolerant 3T1D-Based Cache Architectures
Process variations will greatly impact the stability, leakage power consumption, and performance of future microprocessors. These variations are especially detrimental to 6T SRAM ...
Xiaoyao Liang, Ramon Canal, Gu-Yeon Wei, David Bro...