117 search results - page 8 / 24 » Improving Communication Using 3D Animation |
ICCAD
2010
IEEE
13 years 5 months ago
2010
IEEE
3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
CGA
2011
12 years 11 months ago
2011
—We describe a graphics system that significantly improves the visual quality of certain types of 3D character motion animated through traditional means by inferring physical pr...
MM
2004
ACM
14 years 24 days ago
2004
ACM
This paper looks at the problem of multi-streaming in 3D teleimmersion and describes how a protocol architecture called CP (for Coordination Protocol) can be used to coordinate vi...
ISBI
2002
IEEE
14 years 8 months ago
2002
IEEE
3D Electron Microscopy aims at the reconstruction of density volumes corresponding to the mass distribution of macromolecules imaged with an electron microscope. There are many fa...
ICCAD
2008
IEEE
14 years 4 months ago
2008
IEEE
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...