Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
The multilevel placement package mPL6 combines improved implementations of the global placer mPL5 (ISPD05) and the XDP legalizer and detailed placer (ASPDAC06). It consistently pr...
Tony F. Chan, Jason Cong, Joseph R. Shinnerl, Kent...
The load-store unit is a performance critical component of a dynamically-scheduled processor. It is also a complex and non-scalable component. Several recently proposed techniques...
In RoboCup-98, sparrows team worked hard just to get both a simulation and a middle size robot team to work and to successfully participate in a major tournament. For this year, we...
In this paper we present a performance study of memory reference behavior in network protocol processing, using an Internet-based protocol stack implemented in the x-kernel runnin...
Erich M. Nahum, David J. Yates, James F. Kurose, D...