Scalable heterogeneous computing systems, which are composed of a mix of compute devices, such as commodity multicore processors, graphics processors, reconfigurable processors, ...
Anthony Danalis, Gabriel Marin, Collin McCurdy, Je...
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
In some applications such as filling in a customer information form on the web, some missing values may not be explicitly represented as such, but instead appear as potentially va...
Abstract-- In nanometer-scale VLSI technologies, several interconnect issues like routing congestion and interconnect delay have become the main concerns in placement. However, all...
An algorithm called Modoc", which has been introduced elsewhere, enhances propositional model elimination with autarky pruning, and other features. The model elimination meth...